Walk-in Test Chamber

APPLICATIONS

Suitable for low temperature, high temperature, high and low temperature changes, constant damp heat, high and low temperature alternating damp heat and other tests of complete machines or large components. The size and function of the studio can be changed according to user requirements. The block-type box has a beautiful shape and a scientific air duct design to meet the needs of different customers.

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Product Features

FirstTemperature Cotrol -80℃～+150℃

SecondTemperature accuracy ≤±0.1℃

ThirdTemperature uniformity ≤±1℃ (no load)

FourthWorkshop size and function can be changed according to user requirements

Product Parameters

Mode		GD-8000-C-BR
Inner box capacity		8000L
Inner box size (WHD) cm		200200200
Outer box size (WHD) cm		224242350
Temperature range		-80~+150℃
Temperature uniformity		≤±1℃(unloaded)
Temperature fluctuation		≤1℃
Temperature accuracy		≤±0.1℃
Heating rate		(No load) 1 ℃/min adjustable nonlinearity; (Customizable at 5-25 ℃)
Cooling rate		(No load) 1 ℃/min adjustable nonlinearity; (Customizable at 5-25 ℃)
Cryogen		R404A/R23
Test hole		φ100mm×1
Heater		Electric heating
Window size cm		450*490(2 pieces)
Condenser（A）		finned heat exchanger
Condenser（W）		Plate/sleeve/shell and tube heat exchanger
Air circulation		Extended shaft motor, stainless steel centrifugal fan blades
Cooling method		Cascade refrigeration
Compressor		Brand variable frequency compressor
Control method		Segmented Fuzzy PID Algorithm Control
Communication protocol interface		TCP/RS485 (CAN customizable)
Operation panel		7-inch color touch screen, temperature curve display \ EXCEL data export
Sensors		PT100 A-grade platinum resistor
Protector		Heater dual temp protection, refrigeration system protection, and electrical overcurrent and overload protection, etc
Power Supply		380V 50HZ
Insulation material		Glass fiber cotton&polyurethane
Inner box material		SUS304 stainless steel
Outer box material		Cold-rolled steel plate+spray coating
Execution standards		GB/T 2423.1、GB/T 2423.2、GJB 150.3A、GJB 150.4A、GB/T 5170

APPLICATIONS

Temperature control unit of semiconductor FAB process

Semiconductor manufacturing is a process with extremely high environmental requirements, and many process steps are very sensitive to temperature.
Precise temperature control can ensure uniform thickness and accurate composition of deposited films, thereby improving chip performance and yield.

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Temperature Control Solutions for Semiconductor packaging and testing process

Semiconductor packaging and testing process is a key link in the semiconductor production process, including wafer testing, chip packaging and post-packaging testing. This process requires not only a high degree of accuracy and reliability, but also strict temperature control to ensure product quality and performance.

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Why choose lneya as your temperature control supplier?

Since our founding in 2006, we have served over 30,000 customers and hold several patents that demonstrate our innovation and reliability. Our chillers are selected for over 100 university laboratory projects worldwide and exported to over 20 countries. We ensure the highest quality through a rigorous 3-step quality control process: visual inspection, performance testing, and electrical safety testing. Our commitment to excellence is further backed by our 24/7 customer support commitment. In addition, we have agents in the United States, Canada, Australia, Russia, and South Korea, making us a global, trusted partner for your chiller needs. Choose lneya for quality and support for your project.

18+

Years of experience

30000+

Satisfied Customers

25000

m² Production Area

80+

Patented Technologies

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