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Semiconductor Packaging & Testing Process

LNEYA has rich experience in product research and development in the semiconductor packaging and testing industry, and its rich product line meets various temperature control needs in the industry.

Products include: FLTZ series high-precision chiller heaters, LT series refrigeration chillers, heat exchange and temperature control units ETCU, direct cooling machines ZLJ/ZLTZ, gas chillers AES/LQ/AI/AET/gas dryers, chamber test boxes and other products.

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Semiconductor packaging and testing process is a key link in the semiconductor production process, including wafer testing, chip packaging and post-packaging testing. This process requires not only high precision and reliability, but also strict temperature control to ensure product quality and performance.
The typical packaging process is: dicing, mounting, bonding, plastic sealing, deburring, electroplating, printing, cutting and molding, appearance inspection, finished product testing, packaging and shipment.

High Precsion Chiller HeaterFLTZ series
High Precsion Refrigeration ChillerLT series
Heat Exchange ChillerETCU series
High-efficiency Direct Cooling ChillerZLTZ/ZLJ series
Test Chambers
Gas Cooling ChillersAES/LQ/AI/AET/DR series

FLTZ Frequency Conversion Series

—Temperature control accuracy ±0.05℃ (Outlet temperature steady state)

-90~+100℃, mainly used for precise temperature control in semiconductor production and testing processes. The company applies a variety of algorithms in the system to achieve fast system response and high control accuracy.

LT Fixed Frequency Series

—Compressor cascade refrigeration, temp as low as -80℃

LNEYA Refrigeration Chiller temperature range is from -80℃ to -5℃, using secondary supercooling technology, rapid cooling. Strong product reliability and excellent performance.

Heat Exchange Chiller ETCU

—No compressor

ETCU compressor-free heat exchange system, the system can be universal expansion tank, condenser, cooling water system, etc., which can effectively reduce the size of equipment and reduce the number of operating steps.

ZLTZ高效换热控温机组

—高效换热,可⾃动回收导热介质

ZLTZ控温机组与微通道反应器组合成⾼放热量控温运⽤,同流量⼯况下相对于导热油换热控温传热效率5倍以上,同时进出⼝温差⼩,温度场均匀性⾼,特别适合剧烈放热反应的应⽤;

ZLJ系列直冷机

—可运用于⽓体捕集

将制冷系统中的制冷剂直接输出蒸发进⼊⽬标控制元件(换热器)换热,从⽽使⽬标控制对象降温。具备换热能力相对于流体(⽓体)输送⼊换热器换热能⼒更⾼⼀般在5倍以上,这样特别适⽤于换热器换热⾯积⼩,但是换热量⼤的运⽤场所。

Rapid Temp Change Test Chamber

—Fast temperature change, fast heating and cooling rate

Applicable to environmental stress screening test, through environmental stress screening of products, accelerate the discovery of product design defects and improve product reliability. Many industries have realized that high-speed temperature change cycle testing can identify unreliable systems that have already entered the production test stage. It has become a standard method for improving quality and effectively extending the normal working life of products.

Two-door Impact Test Chamber

—Impact test, low temp -40~0℃ high temp +60~+150℃

The test basket is mobile during high and low temperature impact tests. The high and low temperature impact conversion is mainly completed by moving the test basket up and down in the high temperature zone and the low temperature zone. The impact recovery time of the two-box type is shorter than that of the three-box type.

Walk-in Test Chamber

—Temperature control range: -80℃~+150℃

Suitable for low temperature, high temperature, high and low temperature changes, constant damp heat, high and low temperature alternating damp heat and other tests of complete machines or large components. The size and function of the studio can be changed according to user requirements. The block-type box has a beautiful shape and a scientific air duct design to meet the needs of different customers.

LQ series

—Low temperature can reach -110℃

Applied to cool down the gas (non-corrosive): when dry compressed air, nitrogen, argon and other normal temperature gases are introduced into the LQ series equipment, the outgoing gas can reach the target low temperature and be supplied to the components or heat exchangers to be tested.

AES系列热流仪

—升降温速率快,+150℃〜-55℃低于10S

射流式⾼低温冲击测试机给芯⽚、模块、集成电路板、电⼦元器件等提供精确且快速的环境温度。是对产品电性能测试、失效分析、可靠性评估的仪器设备。

AET系列气体快速温变测试机

—可选择控制出口气体温度和工艺目标过程温度

压缩空⽓进⼊⽓体快速温变测试机,内置有⼲燥器,预先把⽓体⼲燥到露点温度-70度以下,进⾏制冷加热控温输出稳定流量压⼒恒温的⽓体,对⽬标对象进⾏控温(如各类控温卡盘、腔体环境、热承板、料梭、腔体、电⼦元件等),可根据远程卡盘上的温度传感器进⾏⼯艺过程控温,⾃动调节输出⽓体的温度。

AI系列循环风系统

—循环风高低温恒温测试

运⽤于半导体设备⾼低温测试。电⼦设备⾼温低温恒温测试冷热源;独⽴的制冷循环⻛机组;可连续⻓时间⼯作,⾃动除霜,除霜过程不影响库温;

Dryer气体干燥器

—低露点⼲燥和清洁

应⽤于传感器、半导体制造、薄膜和包装材料执照、粉状物料运输、喷涂系统、⻝品⾏业、制药⾏业等需要实现-80℃低露点⼲燥和清洁的分布式⽓源。