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GD Series Rapid Temperature Change Test Chamber

GD Series Rapid Temperature Change Test Chamber

APPLICATIONS

It is suitable for environmental stress screening tests. By performing environmental stress screening on products, it accelerates the discovery of product design defects and improves product reliability. Many industrial fields have realized that high-speed temperature change cycle tests can find unreliable systems that have entered the production test stage. It has been used as a standard method to improve quality and effectively extend the normal working life of products.

Model GD-500-B-KS GD-1000-B-KS GD-500-C-KS GD-500-C-KS
Temperature range -40℃~+150℃  -80℃~+150℃
Inner box size (W*H*D) cm 90*65*90 100*100*100 90*65*90 100*100*100
Heating rate (+20~+150℃)A:5℃/min(Customizable at 15~25℃),5℃/min Adjustable nonlinearity
Cooling rate (Carrying idler)(+20~-40℃)5℃/min (Carrying idler)10℃/min(Customizable at 15~25℃)
Temperature uniformity ≤±1℃(unloaded)
Temperature fluctuation ≤±0.5℃
Temperature accuracy ≤±0.1℃
Window size cm 30*45 45*49 30*45 45*49
Cryoge R404A/R23
Test hole φ100mm×1
Heater Electric heating
Condenser(A) Air cooling: finned heat exchanger
Condenser(W)  Water cooling: plate/sleeve/shell and tube heat exchanger
Air circulation Extended shaft motor, stainless steel centrifugal fan blades
Cooling method Cascade refrigeration
Compressor Brand variable frequency compressor
Control method Segmented Fuzzy PID Algorithm Control
Communication protocol interface TCP/RS485 (CAN customizable)
Operation pane 7-inch color touch screen, temperature curve display \ EXCEL data export
Sensors PT100 A-grade platinum resistor
Protector Heater dual temp protection, refrigeration system protection, and electrical over current and over load protection, etc
Outer box size (W*H*D) cm 110*212*175 120*232*225 110*212*175 120*232*225
Power Supply 380V 50HZ
Texture of materia Insulation material: glass fiber cotton&polyurethane
Inner box material: SUS304 stainless steel;
Outer box material: cold-rolled steel plate+spray coating
Execution standards GB/T 2423.1;GB/T 2423.2;GB/T 2423.3;GB/T 2423.4;GB/T 5170.2;GB/T 5170.5;GB/T 11158;GB/T 10589;GB/T 10592; GB/T 10586;IEC 60068

 

APPLICATIONS

Temperature control unit of semiconductor FAB process

Semiconductor manufacturing is a process with extremely high environmental requirements, and many process steps are very sensitive to temperature.
Precise temperature control can ensure uniform thickness and accurate composition of deposited films, thereby improving chip performance and yield.

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Temperature Control Solutions for Semiconductor packaging and testing process

Semiconductor packaging and testing process is a key link in the semiconductor production process, including wafer testing, chip packaging and post-packaging testing. This process requires not only a high degree of accuracy and reliability, but also strict temperature control to ensure product quality and performance.

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