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Two-door Shock Test Chamber

Two-door Shock Test Chamber

APPLICATIONS

When conducting high and low temperature shock tests, the test basket is mobile, mainly relying on the test basket to move up and down in the high temperature zone and the low temperature zone to complete the high and low temperature shock conversion, and the two-box type has a shorter shock recovery time than the three-box type.

Product Features

Mode GD-200-2-B-CJ GD-400-2-B-CJ
Basket size (W * H * D) cm 60*60*60 90*65*70
Impact temperature range Low temperature -40~0℃
High temperature +60~+150℃
Heating rate of preheating zone (No load) 5 ℃/min (customizable for 10-25 ℃)
Cooling rate of pre cooling zone (No load) 2 ℃/min (customizable for 5-25 ℃)
Pre cooling area Pre cooling range  -10℃~-55℃
Preheating area preheating range +60~+180℃
Residence time ≥30min
Recovery time ≤ 5 minutes to recover to within ± 2 ℃
Temperature fluctuation ≤1℃
Residence time ≥30min
Basket conversion time ≤10S
Window size cm 300*450
Cryogen R404A/R23
Heater Electric heating
Condenser(A) finned heat exchanger
Condenser(W) Plate/sleeve/shell and tube heat exchanger
Air circulation Extended shaft motor, stainless steel centrifugal fan blades
Cooling method Cascade refrigeration
Compressor Brand variable frequency compressor
Control method Segmented Fuzzy PID Algorithm Control
Communication protocol interface TCP/RS485 (CAN customizable)
Operation panel 7-inch color touch screen, temperature curve display \ EXCEL data export
Sensors PT100 A-grade platinum resistor
Protector Heater dual temp protection, refrigeration system protection, and electrical overcurrent and overload protection, etc
Dimensions (W*H*D)cm 149*219*257 179*239*257
Power Supply 380V 50HZ
Insulation material Glass fiber cotton&polyurethane
Inner box material SUS304 stainless steel
Outer box material Cold-rolled steel plate+spray coating
执行满足标准 GB/T 2423.1、GB/T 2423.2、GJB 150.3A、GJB 150.4A、GB/T 5170

APPLICATIONS

Temperature control unit of semiconductor FAB process

Semiconductor manufacturing is a process with extremely high environmental requirements, and many process steps are very sensitive to temperature.
Precise temperature control can ensure uniform thickness and accurate composition of deposited films, thereby improving chip performance and yield.

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Temperature Control Solutions for Semiconductor packaging and testing process

Semiconductor packaging and testing process is a key link in the semiconductor production process, including wafer testing, chip packaging and post-packaging testing. This process requires not only a high degree of accuracy and reliability, but also strict temperature control to ensure product quality and performance.

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