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Left & Right Multi-layer Test Chamber

Left & Right Multi-layer Test Chamber

APPLICATIONS

Left and right multi-layer test chambers provide temperature range -80℃~+150℃ wide temperature range temperature control, no-load temperature uniformity ±1℃, temperature accuracy ±0.1℃, to meet the needs of diverse scenarios.

Mode

GD-518-2-C-DC

nside
dimensions
(W*H*D)
Left cavity cm 60*124.5*65
Right cavity cm 60*124.5*65
Temperature range  -80℃~150℃
Heating rate (No load) -40 ℃ →+125 ℃ 1 ℃/min (customizable for 5-25 ℃)
Cooling rate (No load) 125 ℃ → -40 ℃ 1 ℃/min (customizable for 5-25 ℃)
Temperature uniformity ≤±1℃(unloaded)
Temperature accuracy ≤±0.1℃
Cryogen R404A/R23
Heater Electric heating
Condenser(A) finned heat exchanger
Condenser(W) plate/sleeve/shell and tube heat exchanger
Air circulation Extended shaft motor, stainless steel centrifugal fan blades
Cooling method Cascade refrigeration
Compressor Brand variable frequency compressor
Control method Segmented Fuzzy PID Algorithm Control
Communication protocol interface TCP/RS485 (CAN customizable)
Operation panel 7-inch color touch screen, temperature curve display \ EXCEL data export
Sensors PT100 A-grade platinum resistor
Protector Heater dual temp protection, refrigeration system protection, and electrical overcurrent and overload protection, etc
Outer box size (W*H*D) cm 409*236*175
Power Supply 380V 50HZ
Insulation material Glass fiber cotton&polyurethane
Inner box material SUS304 stainless steel
Outer box material Cold-rolled steel plate+spray coating
Execution standards GB/T 2423.1;GB/T 2423.2;GB/T 2423.3;GB/T 2423.4;GB/T 5170.2;GB/T 5170.5;GB/T 11158;GB/T 10589;GB/T 10592; GB/T 10586;IEC 60068-3-5

 

APPLICATIONS

Temperature control unit of semiconductor FAB process

Semiconductor manufacturing is a process with extremely high environmental requirements, and many process steps are very sensitive to temperature.
Precise temperature control can ensure uniform thickness and accurate composition of deposited films, thereby improving chip performance and yield.

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Temperature Control Solutions for Semiconductor packaging and testing process

Semiconductor packaging and testing process is a key link in the semiconductor production process, including wafer testing, chip packaging and post-packaging testing. This process requires not only a high degree of accuracy and reliability, but also strict temperature control to ensure product quality and performance.

Learn more>

Since our founding in 2006, we have served over 30,000 customers and hold several patents that demonstrate our innovation and reliability. Our chillers are selected for over 100 university laboratory projects worldwide and exported to over 20 countries. We ensure the highest quality through a rigorous 3-step quality control process: visual inspection, performance testing, and electrical safety testing. Our commitment to excellence is further backed by our 24/7 customer support commitment. In addition, we have agents in the United States, Canada, Australia, Russia, and South Korea, making us a global, trusted partner for your chiller needs. Choose lneya for quality and support for your project.
18+

Years of experience

30000+

Satisfied Customers

25000

m² Production Area

80+

Patented Technologies

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