Semicnductor Multi-channel Chiller

FLTZ -45℃~100℃

Temperture accuracy±0.1℃
RefrigentR404A
Flow control25~75/min 6bar max
Power range380V 3kW~17kW

Temperature control in semiconductor production testing processes

Heating method within 40 ℃ adopts a compressor hot gas heating fully enclosed design, and the machine operates continuously for 24 hours

Ensure stable and reliable overall semiconductor process flow from front-end to back-end

Mainly used for precise temperature control in semiconductor production and testing processes, heating within 40 ° C using a compressor hot gas heating method

Configuration Details

FLTZ -20℃~90℃ Dual Channel

Model	FLTZ-203W-2T
Pipeline	Channel 1	Channel 2
Temperature range	-20℃～+90℃	-20℃~～90℃
Temperature control accuracy	±0.1℃	±0.1℃
Cooling capacity	4kW@-10℃	4kW@-10℃
Heating capacity	2kW	2kW
Heat transfer medium flow	20L/min@0.5MPa	20L/min@0.5MPa
Heat transfer medium interface	ZG3/4	ZG3/4
Ambient temperature	10～35℃	10～35℃
Ambient humidity	30～70%	30～70%
Cooling water temperature	15～20℃	15～20℃
Cooling water flow	20L/min	20L/min
Circuit breaker	30A
Process temperature control	Control remote target temperature based on self-created model-free self-building tree algorithm and cascade algorithm
Weight	400kg
Dimensions	5009001600

FLTZ -10℃~90℃ Dual Channel

Model	FLT-215W/ETCU-015W/ETCU-008W
Pipeline	Channel 1	Channel 2	Channel 3
Temperature range	-20℃～+50℃	+30℃～+100℃	+30℃～+40℃
Temperature control accuracy	±0.1℃	±0.1℃	±0.1℃
Cooling capacity	15kW@-10℃	13kW@PCW+15℃	8kW@PCW+10℃
Heating capacity	2kW	6kW	Pump Heat Loss
Heat transfer medium flow	30L/min@0.85MPa	30L/min@0.85MPa	20L/min@0.8MPa
Heat transfer medium interface	ZG3/4	ZG3/4	ZG3/4
Ambient temperature	10～35 ℃	10～35 ℃	10～35 ℃
Ambient humidity	30～70%	30～70%	30～70%
Cooling water temperature	15～20℃	15～20℃	15～20℃
Cooling water flow	30L/min@15~20℃	15L/min@15~20℃	15L/min@15~20℃
Circuit breaker	75A
Process temperature control	Control remote target temperature based on self-created model-free self-building tree algorithm and cascade algorithm
Weight	600kg
Dimensions	60010001700

Model	FLTZ-203W/2T Dual system		FLTZ-305W/2T Dual system		FLTZ-406W/2T Dual system
Temperature range	-20℃~90℃		-30℃~90℃		-45℃~90℃
Temperature control accuracy	±0.1℃
Flow control and pressure	15~45l/min 6bar max
Heating	2.5kw	2.5kw	2.5kw	2.5kw	3.5kw	3.5kw
Cooling capacity	3KW at-15℃	3KW at-15℃	5KW at-15℃	5KW at-15℃	2.5KW at -35℃	2.5KW at -35℃
Internal circulation liquid volume	5L	5L	8L	8L	8L	8L
Expansion tank volume	15L		25L		25L
Heat transfer medium	Fluorination, antifreeze, thermal silicone oil, etc.
Refrigerant	R404A/ R448
Heat transfer medium interface	ZG3/4
Cooling water interface	ZG3/4
Cooling water	50L/min at20℃		600L/min at20℃		50L/min at20℃
Power supply	Three-phase220V / Three-phase 400V /Three-phase 460V
Process temperature control	Control remote target temperature based on self-created model-free self-building tree algorithm and cascade algorithm

FLTZ -45℃~90℃ Dual Channel

Model	FLTZ-203W/2T dual system		FLTZ-305W/2T dual system		FLTZ-406W/2T dual system
Temperature range	-20℃~90℃		-30℃~90℃		-45℃~90℃
Temperature control accuracy	±0.1℃
Heat conducting medium flow rate	15~45l/min 6bar max
Heating capacity	2.5kW	2.5kW	2.5kW	2.5kW	3.5kW	3.5kW
Cooling capacity	3kW at-15℃	3kW at-15℃	5kW at-15℃	5kW at-15℃	2.5kW at -35℃	2.5kW at -35℃
Internal circulation fluid volume	5L	5L	8L	8L	8L	8L
Expansion tank volume	15L		25L		25L
Heat-conducting medium	Fluorinated liquid, antifreeze, thermal conductive silicone oil, etc
Refrigerant	R404A/ R448
Heat-conducting medium interface	ZG3/4
Cooling water interface	ZG3/4
Cooling water interface	50L/min at20℃		600L/min at20℃		50L/min at20℃
Power	Three phase 220V/Three phase 400V/Three phase 460V
Process temperature control	The remote target temperature can be controlled by combining the self created model free self built tree algorithm and cascade algorithm

Descriptions

Multi-channel independent temperature control can have separate temperature ranges, cooling and heating capabilities, heat transfer medium flow, etc. Two independent systems are used. Steam compression refrigeration or ETCU compressor-free heat exchange system can be selected according to the required temperature range. The system can use expansion tanks, condensers, cooling water systems, etc., which can effectively reduce equipment size and reduce operating steps.

chillers that control the processing temperature on the Fab equipments

Single channel air-cooled cooler, mainly designed for etching machines. It is used to provide independent temperature control for the chamber side walls.