Heating within 40 ° C by the hot air of the gas extraction compressor

The Chiller circulation system adopts a fully enclosed design and uses a magnetic driven pump.

Chiller 100% helium testing, 100% safety compliance testing to ensure safety and reliability.

Chiller 100% continuous operation of the copying machine after 24 hours

Applications:

Temperature control range: -105 ℃ to+125 ℃

Used for low-temperature testing of semiconductor equipment. Electrical equipment – temperature, low temperature, constant temperature testing of cold and heat sources; Unique refrigeration cycle unit.

Features:

Can work continuously for a long time, automatically defrost, and the defrosting process does not affect the storage temperature; Modular design, easy replacement of backup units (only one backup unit is needed)

Solve the problem of frequent on-off and frost formation in the evaporation system; The defrosting process of the evaporation system does not affect it.

Applications:

The jet type high and low temperature impact testing machine provides accurate and fast environmental temperature for chips, modules, integrated circuit boards, electronic components, etc. It is an indispensable instrument and equipment for product electrical performance testing, failure analysis, and reliability evaluation.

Temperature control range: -120 ℃ to+300 ℃, with a very fast temperature rise and fall rate, 150 ℃ to -55 ℃<10 seconds, maximum flow rate: 30m ³/ H

Features:

Real time monitoring of the actual temperature of the tested IC, achieving closed-loop feedback, real-time adjustment of the temperature rise and fall time of the body, programmable operation, manual operation, and remote control

Test conditions: ambient temperature of 20 ℃, 30m ³/ h. 5 bar, compressed air or nitrogen can be customized for 100m ³/ H-body flow rapid impact testing machine, suitable for testing power requirements at full flow rate.

Applications:

A full chain layout of liquid cooled server supporting infrastructure is provided by liquid cooled CDU distribution units to provide cooling liquid for the cooling plates inside the server rack. The maximum utilization of liquid cooled plate heat exchange cools the main heat sources inside the server, reducing the use of the cooling system, helping the server achieve higher power cooling requirements and higher computational density for individual cabinets, further reducing PUE, achieving “carbon peak” and “carbon neutrality” Under the vision, we aim to promote the development of green and high-quality data.

Features:

Cold Plate Type 15kW

Cabinet Type 300kW

chillers that control the processing temperature on the Fab equipments

Single channel air-cooled cooler, mainly designed for etching machines. It is used to provide independent temperature control for the chamber side walls.

Heating function

Communication function

Dynamic Temperature Control Systems (Biochemistry Pharmaceutical Process)

Temperature Control :-120℃~350℃

Temperature control for high pressure reactor；Double-layer glass reactor；Double-layer reactor；Microchannel Reactor；Distillation system；Material aging test；Vacuum chamber etc.

Control Temperature Control Flow Systems（Vehicle/Battery Pack Test)

Temperature Control: -40℃~100℃

Temperature simulation for vehicle quality test: battery life test, fuel injector/motor test bench, airbag test, component test bench, etc. It can simulate the external environmental conditions in the climate chamber or replace the internal system, which can create the necessary actual temperature conditions for the test bench.

Cooling Heating Systems (Semiconductor Production）

Temperature Control: -85℃~250℃

Suitable for semiconductor process wet washing, photolithography, etching, chemical meteorological deposition, physical meteorological deposition, and the electronics industry (photolithography process)