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LTS -60℃~80℃

LTS -60℃~80℃ Fluoride cooling heating system

Temperature control during semiconductor manufacturing
  • Flow control12L/min~45L/min
  • Temperature accuracy±0.1℃ @-60℃~-30℃
  • Internal circulating liquid4L~10L
  • Expansion tank10L~20L
  • Place of OriginChina

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Parameters Detailed

Model LTS-602 LTS-603 LTS-604 LTS-606 LTS-608
LTS-602W LTS-603W LTS-604W LTS-606W LTS-608W
Temperature range   -60℃~-20℃
Temperature control accuracy ±0.1℃  -60℃~-30℃
Flow control  7~25L/min 12~45L/min
  The flow control adopts frequency converter adjustment, and the speed is automatically adjusted according to the feedback signal of the flow sensor. The maximum pressure of the circulating pump is 5bar.
Internal circulating fluid volume 4L 5L 6L 8L 10L
Expansion tank volume 10L 10L 15L 15L 20L
System pressure display The pressure of the refrigeration system is realized by a pointer pressure gauge (high pressure, low pressure)
The pressure acquisition outlet position of the circulatory system is detected by a pressure sensor and displayed on the touch screen
Controller PLC, fuzzy PID control algorithm, with cascade control algorithm
Temperature control Heat transfer medium outlet temperature control mode
External temperature sensor: (PT100 or 4~20mA or communication setting) control mode (cascade control)
Letter of agreement Ethernet interface TCP/IP protocol
RS485 interface modbus RTU protocol
Internal temperature feedback of equipment Equipment heat transfer medium outlet temperature, medium inlet temperature, refrigeration system condensation temperature, ambient temperature, compressor suction temperature, cooling water temperature (available for water-cooled equipment)
Closed circulation system The whole system is a fully enclosed system, low temperature does not absorb moisture in the air, does not volatilize the heat transfer medium, and the low temperature automatically supplements the heat transfer medium into the circulation system
Compressor Emerson Copeland/Danfoss Scroll Flexible Compressor
Circulating pump Magnetic circulation pump
Evaporator Plate heat exchanger
Condenser Micro channel condenser (air-cooled)
Plate heat exchanger (water-cooled), special attention: clean factory water is required
Refrigeration accessories Danfoss/Emerson accessories (filter drier, oil separator, high and low pressure protector, expansion valve)
Operation panel Wuxi Guanya customized 7-inch color touch screen, temperature curve display\EXCEL data export
Security With self-diagnosis function; phase sequence open-phase protector, refrigerating machine overload protection; high-pressure pressure switch, overload relay, thermal protection device and other security functions.
In and out interface size ZG1/2 ZG1/2 ZG3/4 ZG3/4 ZG3/4

Product Description

It is widely used in the semiconductor manufacturing process to control the temperature of the reaction chamber, the temperature of the heat sink, and the temperature control of the non-flammable fluid of the heat transfer medium.

1. The pressure holding test of the medium circulation system is 7 bar.
2. Use high-quality magnetic pump without mechanical shaft seal.
3. Optimize temperature sampling and response speed, specially design control algorithm, can respond quickly to stable temperature control.
4. Enhance the design of the circulating pump capacity to meet the high-lift requirements of the system.
5. Continuous high-temperature cooling technology meets the requirements for stable operation when heat is loaded on the heat sink plate and requires cooling and heating constant temperature control.
6. In view of the volatile characteristics of fluorinated liquid, the joint design and system sealing design are strengthened to ensure the service life of the medium.

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