TES -45℃~250℃

cooling heating system temperature control for Semiconductor test

Dynamic Temperature Control Systems Semiconductor Test Chillers TES series

Heating Power3kW~25kW
Cooling capacity0.3kW~25kW
Power range6kW~36kW
Medium accuracy±0.3℃
Flow pressure25L/min~150L/min 2.5bar
RefrigerantR404A/R507C

dynamic temperature control system semiconductor test chiller TES TES series

INQUIRY

Product data download

manual.pdf

Parameters

Temperature control range：-45°C ~ 250°C ；Power range：2.5kW~25kW；Temperature control accuracy：±0.3°C

Chip-Specific High and Low Temperature Test Boxes In the manufacture of semiconductor electronic components for harsh environments, the IC packaging assembly and engineering and production testing phases include electronic thermal testing at temperatures (-85 °C to +200 °C) and other environments. Test the simulation. Once put into practical use, these semiconductor devices and electronic products can be exposed to extreme environmental conditions to meet demanding military and telecommunications reliability standards.

LNEYA represents the international advanced liquid temperature control technology, actively explores and studies component testing systems, mainly used for temperature test simulation in semiconductor testing, with wide temperature orientation and high temperature rise and fall, temperature range -92°C ~ 250°C, suitable for various Test Requirements. LNEYA is committed to solving the problem of temperature control lag in electronic components. Ultra high temperature cooling technology can be cooled directly from 300°C.

Model		TES-4525	TES-4555	TES-45A10	TES-45A15	TES-45A25
		TES-4525W	TES-4555W	TES-45A10W	TES-45A25W	TES-45A25W
Temp. Range		-45℃～250℃	-45℃～250℃	-45℃～250℃	-45℃～250℃	-45℃～250℃
Heating Power		3kW	5.5kW	10kW	15kW	25kW
Refrigerating output	250℃	3kW	5.5kW	10kW	15kW	25kW
	100℃	2.5kW	5.5kW	10kW	15kW	25kW
	20℃	2.5kW	5.5kW	10kW	15kW	25kW
	0℃	2.5kW	5kW	10kW	15kW	25kW
	-20℃	1kW	2.9kW	6kW	11kW	16kW
	-40℃	0.3kW	0.9kW	2kW	3.8kW	5.3kW
Temp. control accuracy of heat conduction medium		±0.3℃	±0.3℃	±0.3℃	±0.3℃	±0.3℃
System pressure display		The pressure of the refrigeration system is realized by the pointer type pressure gauge (high-pressure and low-pressure).
		The circulation system pressure is displayed on the touch screen by pressure sensor detection.
controller		Siemens PLC, Fuzzy PID Control algorithm with Cascade Control algorithm
Temp. control		Temperature Control Mode for outlet of Heat conduction medium;
		External temperature sensor: (PT100 or 4~20mA or communication given) control mode (cascade control)
Programmable5		procedures can be developed, and each program can be composed of 40 steps
Communicating protocol		Ethernet Interface TCP/IP Protocol
Internal temp. feedback of equipment		Equipment heat-conducting medium outlet temperature, medium inlet temperature, refrigeration system condensation temperature, ambient temperature, compressor suction temperature, cooling water temperature (configuration of water-cooling equipment)
External access temp. feedback		PT100 or 4~20mA or communication given
String-level control		The temperature difference between the outlet temperature and the external temperature sensor can be set and controlled；
Temp. difference control function		The temperature difference between the inlet temperature and the outlet temperature of the equipment can be set to be controlled (to protect the safety of the system).
Closed-cycle system		The whole system is a completely closed system with no oil mist at high temperature and no water in the air at low temperature. The system will not increase the pressure due to high temperature and automatically replenish the heat conduction medium at low temperature.
Heating Power		The maximum heating output power of the system (according to each model);
		The heater has triple protection and independent temperature limiter to ensure the safety of heating system;
		The power is more than 10kW and the voltage regulator is adopted, and the heating power output control is controlled by 4-20mA linear control.
Cooling capacity		It refers to the ability to carry away heat at different temperatures (in the ideal state). The actual working conditions need to be considered for environmental heat dissipation. Please enlarge it properly and do well the thermal insulation measures.
Circulation pump flow, pressure max		Adopt LNEYA magnetic drive pump
		25L/min2.5bar	50L/min2.5bar	50L/min2.5bar	110L/min2.5bar	150L/min2.5bar
Compression engine		Tekokang,France	Emerson	Emerson / Danvers	Emerson / Danvers	Emerson / Danvers
Evaporimeter		With DANFOSS/High pressure Plate Heat Exchanger
Refrigeration Accessory		Danfoss / Emerson fittings (dry filters, oil separators, high and low pressure protectors, expansion valves)
Operation panel		LNEYA custom 7-inch color touch screen, temperature curve display\ EXCEL data export
Safe guarding		With self-diagnosis function; phase sequence phase breaker, freezer overload protection; high-voltage pressure switch, overload relay, thermal protection device and other safety protection functions.
Cryogen		R-404A / R507C
Interface size		ZG1/2	ZG3/4	ZG3/4	ZG1	DN32 PN10 RF
Shape size (Air-cooled type)cm		4570160	5570175	6585185	80120185	100150185
Air-cooled type		It adopts copper tube aluminum fin condensation method, upper air outlet type, and the condensation fan adopts German EBM axial flow fan.
Water-cooled type W		Type W is water cooled
Water-cooled Condenser		Casing heat exchanger (Paris / Shen’s)
Cooling water quantity at 25℃		1.1m3/h	1.5m3/h	2.6m3/h	3.6m3/h	7m3/h
Source 380V50HZ		6kW max 220V	9kW max	16kW max	23kW max	36kW max
Source		Customizable 460V 60HZN 220V 60HZ three-phase
Shell material		Cold rolled sheet spray (Standard Colour 7035)
Isolation explosion proof		Customizable isolation explosion proof (EXdIIBT4);
		Installation License No. of Wuxi Guanzi Explosion-proof Product: PCEC-2017-B025
Barotropic explosion protection		A custom positive pressure explosion-proof (EXPXdmbIICT4) positive pressure system must be a water-cooled device;
		Installation License No. of Wuxi Guanzi Explosion-proof Product: PCEC-2017-B025

Product Description

TES
Temperature control range：-45°C ~ 250°C ；Power range：2.5kW~25kW；Temperature control accuracy：±0.3°C
Chip-Specific High and Low Temperature Test Boxes In the manufacture of semiconductor electronic components for harsh environments, the IC packaging assembly and engineering and production testing phases include electronic thermal testing at temperatures (-85 °C to +200 °C) and other environments. Test the simulation. Once put into practical use, these semiconductor devices and electronic products can be exposed to extreme environmental conditions to meet demanding military and telecommunications reliability standards.