TES -85℃~200℃

cooling heating system temperature control Semiconductor test chiller

Heating Power2.5kW~25kW
Cooling capacity0.25kW~25kW
Power range6.5kW~50kW
Medium accuracy±0.3℃
Flow pressure20L/min~150L/min 2.5bar
RefrigerantR404A/R508B

dynamic temperature control system semiconductor test chiller TES series

INQUIRY

Product data download

manual.pdf

Temperature control range：-85°C ~ 200°C ；Power range：6.5kW~50kW；Temperature control accuracy：±0.3°C

Chip-Specific High and Low Temperature Test Boxes In the manufacture of semiconductor electronic components for harsh environments, the IC packaging assembly and engineering and production testing phases include electronic thermal testing at temperatures (-85 °C to +200 °C) and other environments. Test the simulation. Once put into practical use, these semiconductor devices and electronic products can be exposed to extreme environmental conditions to meet demanding military and telecommunications reliability standards.

LNEYA represents the international advanced liquid temperature control technology, actively explores and studies component testing systems, mainly used for temperature test simulation in semiconductor testing, with wide temperature orientation and high temperature rise and fall, temperature range -92°C ~ 250°C, suitable for various Test Requirements. LNEYA is committed to solving the problem of temperature control lag in electronic components. Ultra high temperature cooling technology can be cooled directly from 300°C.

Parameters

Model		TES-8525W	TES-8555W	TES-85A10W	TES-85A15W	TES-85A25W
Temp. Range		-85℃～200℃	-85℃～200℃	-85℃～200℃	-85℃～200℃	-85℃～200℃
Heating Power		2.5kW	5.5kW	10kW	15kW	25kW
Refrigerating Output	200℃	2.5kW	5.5kW	10kW	15kW	25kW
	100℃	2.5kW	5.5kW	10kW	15kW	25kW
	20℃	2.5kW	5.5kW	10kW	15kW	25kW
	0℃	2.5kW	5.5kW	10kW	15kW	25kW
	-40℃	1.5kW	3.3kW	6.5kW	11kW	20kW
	-60℃	0.85kW	1.8kW	3.4kW	6.5kW	10kW
	-80℃	0.25kW	0.45kW	1.5kW	2.5kW	4kW
Temp. Control Accuracy of Heat Conduction Medium		±0.3℃	±0.3℃	±0.3℃	±0.3℃	±0.3℃
System Pressure Display		Pressure of Refrigeration system is realized by pressure gauge (High pressure, low pressure);
		Pressure of circulatory system is detected by pressure sensor and displayed on touch screen.
Controller		Siemens PLC, Fuzzy PID Control algorithm with Cascade Control algorithm.
Temp. Control		Temperature Control Mode for outlet of Heat conduction medium;
		External temperature sensor: (PT100 or 4~20mA or communication given) control mode (cascade control)
Programmable		5 procedures can be developed, and each program can be composed of 40 steps
Communicating Protocol		Ethernet Interface TCP/IP Protocol
Internal Temperature Feedback		Outlet temperature, inlet temperature, condensing temperature, ambient temperature, suction temperature of compressor, cooling water temperature (water cooling equipment configuration) of equipment heat conduction medium outlet temperature, medium inlet temperature, refrigeration system condensation temperature, ambient temperature, compressor suction temperature, cooling water temperature.
External Access Temp Feedback		PT100 or 4~20mA or communication given.
Cascade control time		The temperature difference between the outlet temperature and the external temperature sensor can be set and controlled;
Temp. difference control function		The temperature difference between the inlet temperature and the outlet temperature of the equipment can be set to be controlled (to protect the safety of the system).
Closed-cycle system		The whole system is a completely closed system with no oil mist at high temperature and no water in the air at low temperature. The system will not increase the pressure due to high temperature and automatically replenish the heat conduction medium at low temperature.
Heating Power		The maximum heating output power of the system (According to each model);
		The heater has triple protection and independent temperature limiter to ensure the safety of heating system;
		The power is more than 10kW and the voltage regulator is adopted, and the heating power output control is controlled by 4-20mA linear control.
Refrigerating Capacity		Refers to the ability to take away heat at different temperatures (ideal condition), the actual working conditions need to consider environmental heat dissipation, please enlarge properly, and do a good job of insulation measures.
Circulating pump flow (max)		Magnetic drive pump
		20L/min2.5bar	50L/min2.5bar	50L/min2.5bar	110L/min2.5bar	150L/min2.5bar
Compression Engine		Tecumseh	Emerson Scroll flexible compressor
Evaporimeter		Plate heat exchanger
Refrigeration Accessory		Danfoss / Emerson accessories (dry filters, oil separators, high and low pressure protectors, mirrors)
Expansion Valve		Danfoss thermal expansion valve+Emerson electronic expansion valve
Operation Panel		LNEYA custom 7-inch color touch screen, temperature curve display\ EXCEL data export
Safe Guarding		With self-diagnosis function; phase sequence phase breaker, freezer overload protection; high-voltage pressure switch, overload relay, thermal protection device and other safety protection functions.
Cryogen		R404A R508B
Interface size		ZG1/2	ZG3/4	ZG3/4	ZG1	DN32 PN10 RF
External dimension (water cooling)		5570175	6585185	80120185	100150185	200145205
Water-cooled W		Type W is water cooled
Water-cooled Condenser		Casing heat exchanger (Paris / Shen’s)
Cooling Water At 20 ℃		2000L/H	2400L/H	3500L/H	5200L/H	12m³/H
		1.5bar~4bar	1.5bar~4bar	1.5bar~4bar	1.5bar~4bar	1.5bar~4bar
Power 380V50HZ		7.5kW max	13kW max	22kW max	32kW max	54kW max
Optional		AC 380V 50HZ Three-phase five-wire system
		Customizable 460V 60HZ、220V 60HZ Three-phase
Shell Material		Cold rolled sheet spray (Standard Colour 7035)
Isolation Explosion Proof		Customizable isolation explosion-proof（EXdIIBT4)
		LNEYA Explosive proof product installation license number：PCEC-2017-B025
Barotropic Explosion Protection		Customizable barotropic explosion-proof (EXPXdmbIICT4) barotropic systems must be water-cooled equipment;
		LNEYA Explosive product installation license number: PCEC-2017-B025

Product Description

Temperature control range：-85°C ~ 200°C ；Power range：2.5kW~25kW；Temperature control accuracy：±0.3°C

Chip-Specific High and Low Temperature Test Boxes In the manufacture of semiconductor electronic components for harsh environments, the IC packaging assembly and engineering and production testing phases include electronic thermal testing at temperatures (-85°C to +200°C) and other environments. Test the simulation. Once put into practical use, these semiconductor devices and electronic products can be exposed to extreme environmental conditions to meet demanding military and telecommunications reliability standards.

TES