The necessity of high and low temperature testing machine for semiconductor chips

The rapid development of the chip industry is also obvious to everyone. LNEYA semiconductor chip high and low temperature test machine has also been continuously developed along with the development of the chip industry.

There are tens of thousands of chips running daily in large companies, and the pressure on semiconductor chip high and low temperature testers is very large. When the chip is made by the fab, it will enter the Wafer Test phase. Testing at this stage may be performed at the fab or sent to a nearby test vendor agent. The production engineer will use the automatic test instrument (ATE) to run the program given by the chip designer, and roughly divide the chip into good/bad parts. The bad ones will be directly discarded. If there are too many bad films at this stage, the basic will It is believed that the fab’s own yield is low. If the yield is below a certain value, the fab needs to lose money.

After passing the Wafer Test, the wafer will be cut. The cut chips are sorted according to the previous results. Only good chips will be sent to the package factory. The location of the package is generally near the fab because unpackaged chips cannot be transported over long distances. The type of package depends on the needs of the customer, some require a spherical BGA, and some require a pin. In short, this step is simple and has fewer faults. Since the success rate of the package is much larger than the production yield of the chip, it will not be tested after packaging. After packaging, the chip will be sent to the test factories of major companies, also known as production plants. And carry out the Final Test. There are actually more than a dozen processes in the production plant, and Final Test is just the first step. After the Final Test, you also need to sort, engrave, check the package, package and other steps. Then you can ship to the market. Final Test is the focus of the factory and requires a lot of mechanical and automation equipment. Its purpose is to rigorously classify chips.

Users can find out that the chip test results affect the quality and performance of the product by using the semiconductor chip high and low temperature tester. (This article source network, if there is any infringement, please contact delete, thank you)