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FLTZ Variable Frequency Chillers Multi-channel Series

FLTZ Variable Frequency Chillers Multi-channel Series

APPLICATIONS

Semiconductor air cooling & water cooling Chiller is mainly used for precise temperature control in semiconductor production and testing. Products include fluid fluorinated liquid temperature control (minimum -100 degrees), gas hot and cold rapid temperature change, rapid temperature change chuck, low temperature gas refrigerator (-120 degrees), direct cooling refrigeration unit (-150 degrees), etc. The company applies a variety of algorithms (PID, feedforward PID, model-free self-building algorithm) in the system to achieve fast system response and high control accuracy.

FLTZ  -20℃~+90℃ 

 

Model FLTZ-203W-2T
Pipeline channel 1 channel 2
Temperature range  -20℃~+90℃ -20℃~+90℃
Cooling capacity 4kW@-10℃ 4kW@-10℃
Heating capacity 2kW 2kW
Heat conducting medium flow rate 20L/min@0.5MPa 20L/min@0.5MPa
Heat conducting medium connection size ZG3/4 ZG3/4
Ambient temperature 10~35℃ 10~35℃
Ambient humidity 30~70% 30~70%
Cooling water flow rate 15~20℃ 15~20℃
Cooling water temperature 20L/min 20L/min
Circuit breaker 30A
Weight 400kg
Dimension cm 500*900*1600

 

FLTZ   -45℃~+40

 

Model FLTZ-406W/ETCU-015W
Pipeline channel 1 channel 2
Temperature range -45℃~+40 +10℃~+80
Cooling capacity 11kW@-20
5kW@-40
13kW@+10
Heating capacity 2kW 6kW
Heat conducting medium flow rate 17L/min@0.7MPa 17L/min@0.7MPa
Heat conducting medium connection size ZG3/4 ZG3/4
Ambient temperature 1035 1035
Ambient humidity 3070% 3070%
Cooling water flow rate 1520 1520
Cooling water temperature 40L/min 20L/min
Circuit breaker 80A
Weight 550kg
Dimension cm 600*1000*1850

 

FLTZ  -10℃~+80℃

 

Model FLTZ-203W/ETCU-008W
Pipeline channel 1 channel 2 channel 3
Temperature range -10℃~+60℃ +30℃~+80℃ -10℃~+80℃
Cooling capacity 4kW@-10℃/21kW@+20℃ 6 kW@+30℃ 3kW@-10℃
Heating capacity 4kW 4.5+6kW 3kW
Heat conducting medium flow rate 17L/min@0.7MPa 17L/min@0.7MPa 17L/min@0.7MPa
Heat conducting medium connection size ZG3/4 ZG3/4 ZG3/4
Ambient temperature 10~35 ℃ 10~35 ℃ 10~35 ℃
Ambient humidity 30~70% 30~70% 30~70%
Cooling water flow rate 15~20℃ 15~20℃ 15~20℃
Cooling water temperature 30L/min@15~20℃ 15L/min@15~20℃ 15L/min@15~20℃
Circuit breaker 100A
Weight 600kg
Dimension cm 600*1000*1700

 

FLTZ  -20℃~+50℃

 

Model FLT-215W/ETCU-015W/ETCU-008W
Pipeline channel 1 channel 2 channel 3
Temperature range -20℃~+50℃ +30℃~+100℃ +30℃~+40℃
Cooling capacity 15kW@-10℃ 13kW@PCW+15℃ 8kW@PCW+10℃
Heating capacity 2kW 6kW Pump Heat Loss
Heat conducting medium flow rate 30L/min@0.85MPa 30L/min@0.85MPa 20L/min@0.8MPa
Heat conducting medium connection size ZG3/4 ZG3/4 ZG3/4
Ambient temperature 10~35 ℃ 10~35 ℃ 10~35 ℃
Ambient humidity 30~70% 30~70% 30~70%
Cooling water flow rate 15~20℃ 15~20℃ 15~20℃
Cooling water temperature 30L/min@15~20℃ 15L/min@15~20℃ 15L/min@15~20℃
Circuit breaker 75A
Weight 600kg
Dimension cm 600*1000*1700

 

FLTZ  -45℃~90℃

 

Model FLTZ-203W/2T dual system FLTZ-305W/2T  dual system FLTZ-406W/2T dual system
Temperature range -20℃~90℃  -30℃~90℃ -45℃~90℃
Heat conducting medium flow rate 15~45l/min 6bar max
Heating capacity 2.5kW 2.5kW 2.5kW 2.5kW 3.5kW 3.5kW
Cooling capacity 3kW at-15℃ 3kW at-15℃ 5kW at-15℃ 5kW at-15℃ 2.5kW at -35℃ 2.5kW at -35℃
Internal circulation fluid volume 5L 5L 8L 8L 8L 8L
Expansion tank volume 15L 25L 25L
Heat-conducting medium Fluorinated liquid, antifreeze, thermal conductive silicone oil, etc
Refrigerant R404A/ R448
Heat-conducting medium interface ZG3/4
Cooling water interface ZG3/4
Cooling water interface 50L/min at20℃ 600L/min at20℃ 50L/min at20℃
Power Three phase 220V/Three phase 400V/Three phase 460V

 

APPLICATIONS

Temperature control unit of semiconductor FAB process

Semiconductor manufacturing is a process with extremely high environmental requirements, and many process steps are very sensitive to temperature.
Precise temperature control can ensure uniform thickness and accurate composition of deposited films, thereby improving chip performance and yield.

for Semiconductor packaging & testing process

Semiconductor packaging and testing process is a key link in the semiconductor production process, including wafer testing, chip packaging and post-packaging testing. This process requires not only a high degree of accuracy and reliability, but also strict temperature control to ensure product quality and performance.

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