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Semiconductor probe cooling chiller system

Functional features:

  1. Temperature control: The chiller provides precise temperature control, typically ranging from -40 ° C to over 100 ° C, or even wider, to meet different testing temperature requirements.

2. Stability: The temperature stability of the chiller is extremely high, ensuring minimal fluctuations during the testing process and avoiding temperature fluctuations that may affect the test results.

    3. Quick response: The chiller quickly reaches the set temperature and can be adjusted quickly, reducing waiting time and improving testing efficiency.

      4. Silence and energy-saving: The probe station chiller is designed to operate with low noise and energy efficiency to reduce energy consumption.

        5. Intelligence: Automatic control system for probe chiller, including remote monitoring, alarm, data recording, and fault diagnosis.

        Application:

        1. Chip testing: In semiconductor wafer testing, the probe stage chiller is used to cool the wafer, control the testing environment, and ensure the stability of the equipment and DUT or HTOLBIST (High Temperature Storage Test) during high temperature testing.

        2. Packaging testing: In the post packaging testing (FT) stage of semiconductor packaging, the chiller is also used to maintain the testing temperature and ensure the performance of the chip during high-power testing or high-temperature operation.

          3. Fault analysis: In semiconductor fault analysis, the chiller helps to simulate specific temperature conditions, analyze the performance of the chip at different temperatures, and identify the cause of the fault.

            4. Aging test: In the accelerated aging test of semiconductors, the chiller provides a stable high-temperature environment, accelerates the chip aging process, and quickly verifies its long-term reliability.

              5. Environmental simulation: In environmental testing, semiconductors simulate various temperature conditions to ensure that the chip performs in extreme environments and meets design standards.

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