FLT -100℃~80℃

The main application is to accurately control the temperature in the semiconductor production process and testing process. The heating method is within 40°C and uses compressor hot gas to heat the concentrate.

Cooling Chiller

Temperture accuracy±0.1℃
Flow control12~45/min
TypeLow Temperature Cascade
Power range380V

cooling chiller semiconductor chiller

INQUIRY

Product data download

manual.pdf

Configuration Details

Model	FLT-803W	FLT-805W	FLT-806W	FLT-808W	FLT-810W
Temp Range	-80℃～+80℃
Temperature control accuracy	±0.1℃
Flow Control	7～25L/min		12～45L/min
	The flow control is adjusted by a frequency converter, and the speed is automatically adjusted according to the feedback signal of the flow sensor. The maximum pressure of the circulating pump is 6bar.
Cooling capacity@-70℃	0.6KW	1KW	1.5KW	2KW	3KW
Heating power	2KW	2KW	2KW	3.5KW	3.5KW
Internal Circulation fluid volume	4L	5L	6L	8L	10L
Expansion tank volume	10L	10L	15L	15L	20L
Thermal medium	Fluorinated liquid
Ingress and egress interface	ZG1/2	ZG1/2	ZG3/4	ZG3/4	ZG3/4
Cooling water interface	ZG3/4	ZG3/4	ZG3/4	G1	G1
Cooling Water @20℃	1.8m3/h	2.5m3/h	3m3/h	5m3/h	6m3/h
Power Supply	380V 50HZ
Breaker	25A	25A	32A	40A	50A

Model	FLT-1002W	FLT-1004W
Temp Range	-100℃～+80℃	-100℃～+80℃
Temp Accuracy	±0.1℃	±0.1℃
Flow Control	7～25L/min	12～45L/min
	The flow control is adjusted by a frequency converter, and the speed is automatically adjusted according to the feedback signal of the flow sensor. The maximum pressure of the circulating pump is 6bar.
Cooling Capacity@-90℃	1.5KW	3KW
Heating Power	3.5KW	5.5KW
Internal circulation fluid volume	5L	8L
Expansion tank volume	10L	15L
Thermal medium	Fluorinated liquid
Ingress and egress interface	G3/4	G3/4
Cooling water interface	G3/4	G1
Cooling water @20℃	50L/min 2bar~7bar	100L/min 2bar~7bar
Power	380V 50HZ	380V 50HZ
Breaker	32A	63A
Weight	7008001850	80012001850

chillers that control the processing temperature on the Fab equipments

Single channel air-cooled cooler, mainly designed for etching machines. It is used to provide independent temperature control for the chamber side walls.