FLT 5℃~-40℃
Mainly used for precise temperature control in semiconductor production and testing processes, heating within 40 ° C using a compressor hot gas heating method- Temperture accuracy±0.1℃
- Flow control25~75/min 6bar max
- RefrigentR404A
- Power range380V 3.5kW~16kW
Product data download
Temperature control in semiconductor production and testing processes
Heating method within 40 ℃ adopts a compressor hot gas heating fully enclosed design, and the machine operates continuously for 24 hours
Ensure stable and reliable overall semiconductor process flow from front-end to back-end
Application Process
1.Silicon wafer manufacturing 2.Deposition 3.Photolithography 4.ion implantation
5.Wafer cleaning 6.Electroplating 7.Packaging testing
Configuration Details
Model |
FLT-002 FLT-002W |
FLT-003 FLT-003W |
FLT-004 FLT-004W |
FLT-006 FLT-006W |
FLT-008 FLT-008W |
FLT-010 FLT-010W |
FLT-015 FLT-015W |
Tempearature Control |
5℃~40℃ |
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Temperature accuracy |
±0.1℃ |
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Flow control |
10~25L/min 5bar max |
15~45L/min 6bar max |
25~75L/min 6bar max |
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Refrigeration capacity@10℃ |
6kw |
8kw |
10kw |
15 kw |
20kw |
25kw |
40kw |
Internal circulation liquid volume |
4L |
5L |
6L |
8L |
10L |
12L |
20L |
Expansion tank capacity |
10L |
10L |
15L |
15L |
20L |
25L |
35L |
Refrigerant |
R410A |
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Secondary Refrigerant |
Silicone oil, fluorinated liquid, ethylene glycol aqueous solution, DI, etc. (DI temperature needs to be controlled above 10 ℃) |
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Entry and exit interfaces |
G1/2 |
G1/2 |
G3/4 |
G3/4 |
G3/4 |
G1 |
G1 |
Cooling water outlet |
G1/2 |
G1/2 |
G3/4 |
G1 |
G1 |
G1 |
G1 1/8 |
Cooling water flow rate@20℃ |
1.5m³/h |
2m³/h |
2.5m³/h |
4m³/h |
4.5m³/h |
5.6m³/h |
9m³/h |
power supply 380V |
3.5kW |
4kW |
5.5kW |
7kW |
9.5kW |
12kW |
16kW |
Temperature extension |
By adding an electric heater, expand the temperature range from -25 ℃ to 80 ℃ |
Product Description
The semiconductor temperature control device Chiller is mainly used for precise temperature control in semiconductor production and testing processes. Its products include fluid fluorinated liquid temperature control (minimum -100 degrees), rapid temperature change of gas cooling and heating, rapid temperature change chuck, low-temperature gas refrigeration machine (-120 degrees), direct cooling refrigeration unit (-150 degrees), etc. The company applies various algorithms (PID, feedforward PID, and model free self built tree algorithm) in the system to achieve fast response and high control accuracy.
The important information such as the exhaust and suction temperature (pressure), condensation temperature, cooling water temperature (pressure), inlet and outlet liquid (gas) temperature (pressure), electrical power, current and voltage of each component, and water tank level of the chiller are all comprehensively managed, monitored and recorded through sensors connected to the control system.
Heating method within 40 ℃ adopts compressor hot gas heating.
The chiller circulation system adopts a fully enclosed design, and the circulation pump adopts a magnetic drive pump.
Chiller 100% helium testing, 100% safety regulations testing to ensure system safety and reliability.
The chiller runs the copying machine continuously for 24 hours at 100%.
chillers that control the processing temperature on the Fab equipments
Single channel air-cooled cooler, mainly designed for etching machines. It is used to provide independent temperature control for the chamber side walls.
Heating function
Due to the use of heat generated during heating, circulating heating can be achieved without the need for a heater.
Communication function
Standard equipment includes serial communication (RS232C, RS485) and contact input/output. Can communicate with customer devices or build systems.
client output signal
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