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Dr Series Gas Dryer

Dr Series Gas Dryer

APPLICATIONS

Use in sensors, semiconductor manufacturing, film and packaging material licenses, powder material transportation, spraying systems, food industry, pharmaceutical industry, etc. require distributed air sources with low dew point of -80℃ dry and clean.

Mode DR-300 DR-600 DR-1200
Pressure range  0.65~1.0Mpa
Dew point temperature  -70℃
Gas processing capacity 425L/Min 900L/Min 1750L/Min
Finished gas volume 300L/Min 600L/Min 1200L/Min
Connection Size ZG1/2 ZG1/2 ZG3/4
Power 220V 15W
Dimension cm 200*180*1250 450*180*1250 450*180*1250

 

Distributed gas sources used in sensors, semiconductor manufacturing, film and packaging material licensing, powder material transportation, spraying systems, food industry, pharmaceutical industry, etc. that require -80℃ low dew point drying and cleaning.

Additional filtration of oil and particulate matter, with airflow passing through a filtration level of 0.01 μm, the pre filter prevents the desiccant from being contaminated by dust and oil (which greatly shortens the lifespan of the desiccant).

The compressed air dryer consists of multiple sets of filter cartridges filled with desiccants. The compressed air in the form of mist alternately flows through multiple sets of filter elements, and the moisture in the air will accumulate on the surface of the dryer. After the filtration process reaches a predetermined duration, the airflow will switch to other filter elements, and a portion of the airflow (discharge airflow) will be used to regenerate the dryer of the first filter element. The flushing airflow will be released into the atmosphere. The service life of desiccants is approximately 15000 working hours.

APPLICATIONS

Temperature control unit of semiconductor FAB process

Semiconductor manufacturing is a process with extremely high environmental requirements, and many process steps are very sensitive to temperature.
Precise temperature control can ensure uniform thickness and accurate composition of deposited films, thereby improving chip performance and yield.

for Semiconductor packaging & testing process

Semiconductor packaging and testing process is a key link in the semiconductor production process, including wafer testing, chip packaging and post-packaging testing. This process requires not only a high degree of accuracy and reliability, but also strict temperature control to ensure product quality and performance.

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