LNEYA Industrial Chillers Manufacturer Supplier -
AES Series Thermal Stream Temperature Forcing System
APPLICATIONS
AES series for Automatic test equipment in semiconductor, aerospace, military and other industries. Such as ATE is used to measure the output signal of semiconductor devices，Used to evaluate the properties and performance of DUT, UUT, EUT to ensure use.
Product Parameters
| Temperature range | -40℃～225℃ | -60℃～225℃ | -80℃～225℃ | -100℃～225℃ | -120℃～225℃ |
| Temperature accuracy | ±0.1℃（Steady state outlet temperature） | ||||
| Air requirements | Air filter < 5um air oil content < 0.1um air temp and humidity：5℃-32℃ 0-50%RH | ||||
| Air treatment capacity | 10m³/h-m³/h pressure 5bar-7.6bar | ||||
| Throttling method | Electronic expansion valve | ||||
| Controller | PLC Controller | ||||
| Display and record | The pressure of the refrigeration system is realized by a pointer pressure gauge, and the pressure of the circulation system is detected by a pressure sensor and displayed on the touch screen. |
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| Main components | Danfoss drying filter, Casto solenoid valve, Danfoss pressure controller, EBM fan ( air-cooled ), Danfoss / Emerson oil separator, SMC filter, Emerson electronic expansion valve, Johnson pressure sensor |
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| Compressor | Tecumseh,Dorin | ||||
| High temp cooling | Possess high-temperature 225℃ direct cooling technology to meet the target and quickly cool down during high-temperature operation. |
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| Process control | The remote target temperature can be controlled by combining the self created model free self built tree algorithm and cascade algorithm |
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| Size | 540*690*1320 | 540*690*1320 | 540*690*1320 | 800*1200*1750 | 1000*1500*1850 |
Thermal Solutions for ATE testing
1/CHARACTERISTIC ANALYSIS
2/LOOP TEST
3/IMPACT TEST
4/FAILURE ANALYSIS
The output airflow cover of the testing machine will be covered bythe test product to form a test chamber with a relatively closedspace. The high or low temp airflow output by the testing machinewill cause the surface temp of the test product to change drastically,thus completing the corresponding high and low temp impact test.
It can isolate one lC or original component among many componentsand separately perform high and low tempimpact withoutaffecting other surrounding devices. Compared with the traditionalthermal shock test box, the temp impact rate is faster.
Compared to the traditional thermostat, there are several features:
Temperature range: -120 °C ~ +300 °C;
The temperature rise and fall is very fast, -55 °C ~ 150 °C < 10 seconds;
Temperature control accuracy: ±1 °C;
Temperature setting capability: ±0.1 °C;
Temperature display capability: ±0.1 °C;
Maximum air flow: 25m3/h;
Real-time monitoring of the real temperature of the IC under test to achieve closed-loop feedback and adjust the gas temperature in real time;
The temperature rise and fall time is controllable, programmable operation, manual operation and remote control.
APPLICATIONS
Aerospace materials | Test equipment Temp Control Solution
In the aerospace field, the performance of materials is directly related to the safety, reliability and efficiency of aircraft. With the advancement of technology, the requirements for aerospace materials are becoming higher and higher, especially in special environments such as high temperature, high pressure, high speed and microgravity.
Semiconductor packaging and testing temp control solution
Semiconductor packaging and testing process is a key link in the semiconductor production process, including wafer testing, chip packaging and post-packaging testing. This process requires not only high precision and reliability, but also strict temperature control to ensure product quality and performance.
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