Precision Chiller FL

Feature Description:

The temperature of the heat transfer liquid can be adjusted;
It adopts international famous brand compressors such as Aspara, Danfoss, Meiyoule and Copeland, and has stable performance and can work continuously;
User-friendly design, flexible and convenient;
Microcomputer temperature controller, temperature digital display, adjustment unit 0.1 degree, temperature range -5 degrees to 35 degrees;
Use hot gas bypass to save energy and improve control accuracy;
Multiple fault alarms (over temperature alarm, sensor alarm, high pressure alarm, compressor overheat alarm);
Boot delay protection; all components are safely grounded;
The high performance circulation pump is guaranteed to run 24 hours a day.

Typical Applications:

Semiconductor Manufacturing Device Cooling:

Single chip cleaning, printing machine, automatic clamp installation equipment, spraying equipment, ion plating equipment, etching device, single-chip processing device, slicing machine, packaging machine, the temperature of the developer management, exposure device, magnetic part of the heating device, etc.

Laser Equipment Cooling:

Laser processing, heating part of the welding machine, laser marking device, chemical reaction plant, carbon dioxide laser processing machine, etc.

Other Industries Cooling:

Plasma welding, automatic packaging machine, mold cooling, washing machine, gold-plated groove, resin molding machine, precision grinding machine, injection molding machine of molding parts, etc.

Analysis Of Testing Machine Cooling:

Electronic microscope, ICP lighting light source part of the spectrum analysis device, heating part of the spectrophotometer, X-ray analytical device of heat source, automatic pulse heating part of the banner, the light source of atomic absorption spectrophotometer, etc.

Cooling of the hot part of the semiconductor manufacturing device:
Single wafer cleaning transfer, printing machine, automatic holder mounting device, spraying device, ion plating device, etching device, single wafer processing device, slicer, packaging machine, temperature management of developer, exposure device, heating of magnetic part Device, etc.

Cooling of the heating part of the laser device:
Laser processing, heat generation part of fusion splicer, laser marking device, generating device, carbon dioxide laser processing machine, etc.

Cooling of the heating part of other industrial machines:
Plasma welding, automatic packaging machine, mold cooling, washing machine, gold plating tank, precision grinding machine, injection molding machine, molding part of resin molding machine, etc.

Analyze the cooling of the hot part of the machine:
The light source of the electron microscope, the light source portion of the ICP emission spectroscopic analyzer, the heat generating portion of the spectrophotometer, the heat source of the X-ray analyzing device, the heat generating portion of the automatic pulse banner device, and the light source of the atomic absorption photometer.

Cooling of the cooling medium of CNC machine tools and machining centers.