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How do semiconductor CVD and PVD chillers work?

How the chillers in chemical vapor deposition (CVD) work:

Heat removal: During the CVD process, chemical reactions release a lot of heat. The chiller effectively absorbs this heat by circulating coolant in the cooling system through the external or internal cooling structure of the reaction chamber (such as cooling coils or heat exchangers), preventing the chamber or reactants from overheating and maintaining stable reaction conditions.

Precise temperature control: Chillers are usually integrated with precision temperature control systems, such as PID controllers, which can accurately adjust the temperature and flow of the coolant according to the set point to ensure that the temperature of the reaction chamber is controlled within the range required by the process, which is crucial for controlling the chemical reaction rate and product quality.

Stability and efficiency: The design of the chiller focuses on energy efficiency and stability to ensure that stable cooling performance can be maintained under long-term continuous operation, which is very important for the continuous production of the CVD process.

How the chiller works in physical vapor deposition (PVD):

Thermal management: A lot of heat is also generated during the PVD process, especially during sputtering or evaporation coating. The chiller also uses a coolant circulation system to cool the target, vacuum chamber wall or other parts that need to be cooled to prevent excessive temperature from affecting the quality and uniformity of the deposited layer.

Temperature uniformity: In PVD, the chiller helps maintain temperature uniformity throughout the deposition area, which is crucial for obtaining high-quality thin film coatings. Through precise temperature control, defects can be reduced and the adhesion and performance of the film layer can be improved.

Equipment protection: In addition to direct temperature control, the chiller also plays a role in protecting PVD equipment to avoid equipment damage or performance degradation caused by high temperature.