Test Chambers – LNEYA Industrial Chillers Manufacturer Supplier https://www.lneya.com Air Chiller and Water Chiller Tue, 21 Jan 2025 07:14:09 +0000 en-US hourly 1 https://wordpress.org/?v=6.8.2 https://www.lneya.com/wp-content/uploads/2024/05/logo-lneya-150x150.jpg Test Chambers – LNEYA Industrial Chillers Manufacturer Supplier https://www.lneya.com 32 32 Walk-in Test Chamber https://www.lneya.com/product/chambers/walk-in-test-chamber.html https://www.lneya.com/product/chambers/walk-in-test-chamber.html#respond Fri, 17 Jan 2025 06:58:46 +0000 https://www.lneya.com/industrial-chiller/two-door-impact-test-chamber.html
Walk-in Test Chamber

Test Chambers

APPLICATIONS

Suitable for low temperature, high temperature, high and low temperature changes, constant damp heat, high and low temperature alternating damp heat and other tests of complete machines or large components. The size and function of the studio can be changed according to user requirements. The block-type box has a beautiful shape and a scientific air duct design to meet the needs of different customers.

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Inquiry @ Email

Product Features

First
FirstTemperature Cotrol -80℃～+150℃
Second
SecondTemperature accuracy ≤±0.1℃
Third
ThirdTemperature uniformity ≤±1℃ (no load)
Fourth
FourthWorkshop size and function can be changed according to user requirements

Product Parameters

Mode GD-8000-C-BR
Inner box capacity 8000L
Inner box size (W*H*D) cm 200*200*200
Outer box size (W*H*D) cm 224*242*350
Temperature range  -80~+150℃
Temperature uniformity ≤±1℃(unloaded)
Temperature fluctuation ≤1℃
Temperature accuracy ≤±0.1℃
Heating rate (No load) 1 ℃/min adjustable nonlinearity; (Customizable at 5-25 ℃)
Cooling rate (No load) 1 ℃/min adjustable nonlinearity; (Customizable at 5-25 ℃)
Cryogen R404A/R23
Test hole φ100mm×1
Heater Electric heating
Window size cm 450*490(2 pieces)
Condenser（A） finned heat exchanger
Condenser（W） Plate/sleeve/shell and tube heat exchanger
Air circulation Extended shaft motor, stainless steel centrifugal fan blades
Cooling method Cascade refrigeration
Compressor Brand variable frequency compressor
Control method Segmented Fuzzy PID Algorithm Control
Communication protocol interface TCP/RS485 (CAN customizable)
Operation panel 7-inch color touch screen, temperature curve display \ EXCEL data export
Sensors PT100 A-grade platinum resistor
Protector Heater dual temp protection, refrigeration system protection, and electrical overcurrent and overload protection, etc
Power Supply 380V 50HZ
Insulation material Glass fiber cotton&polyurethane
Inner box material SUS304 stainless steel
Outer box material Cold-rolled steel plate+spray coating
Execution standards GB/T 2423.1、GB/T 2423.2、GJB 150.3A、GJB 150.4A、GB/T 5170

APPLICATIONS

Temperature control unit of semiconductor FAB process

Semiconductor manufacturing is a process with extremely high environmental requirements, and many process steps are very sensitive to temperature.
Precise temperature control can ensure uniform thickness and accurate composition of deposited films, thereby improving chip performance and yield.

Learn more

Temperature Control Solutions for Semiconductor packaging and testing process

Semiconductor packaging and testing process is a key link in the semiconductor production process, including wafer testing, chip packaging and post-packaging testing. This process requires not only a high degree of accuracy and reliability, but also strict temperature control to ensure product quality and performance.

Learn more>

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]]> https://www.lneya.com/product/chambers/walk-in-test-chamber.html/feed 0 Two-door Shock Test Chamber https://www.lneya.com/product/chambers/two-door-shock.html https://www.lneya.com/product/chambers/two-door-shock.html#respond Fri, 17 Jan 2025 06:49:34 +0000 https://www.lneya.com/industrial-chiller/two-door-shock-test-chamber.html
Two-door Shock Test Chamber

Test Chambers

APPLICATIONS

When conducting high and low temperature shock tests, the test basket is mobile, mainly relying on the test basket to move up and down in the high temperature zone and the low temperature zone to complete the high and low temperature shock conversion, and the two-box type has a shorter shock recovery time than the three-box type.

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Inquiry @ Email

Product Features

First
FirstLow temperature -40~0℃; High temperature +60~+150℃
Second
SecondShorter recovery time than three-box impact
Third
ThirdTest basket moves to complete high and low temperature impact
Fourth
FourthResidence time ≥30min；Temperature fluctuation ≤1℃

Product Parameters

Mode GD-200-2-B-CJ GD-400-2-B-CJ
Basket size (W * H * D) cm 60*60*60 90*65*70
Impact temperature range Low temperature -40~0℃
High temperature +60~+150℃
Heating rate of preheating zone (No load) 5 ℃/min (customizable for 10-25 ℃)
Cooling rate of pre cooling zone (No load) 2 ℃/min (customizable for 5-25 ℃)
Pre cooling area Pre cooling range  -10℃~-55℃
Preheating area preheating range +60~+180℃
Residence time ≥30min
Recovery time ≤ 5 minutes to recover to within ± 2 ℃
Temperature fluctuation ≤1℃
Residence time ≥30min
Basket conversion time ≤10S
Window size cm 300*450
Cryogen R404A/R23
Heater Electric heating
Condenser（A） finned heat exchanger
Condenser（W） Plate/sleeve/shell and tube heat exchanger
Air circulation Extended shaft motor, stainless steel centrifugal fan blades
Cooling method Cascade refrigeration
Compressor Brand variable frequency compressor
Control method Segmented Fuzzy PID Algorithm Control
Communication protocol interface TCP/RS485 (CAN customizable)
Operation panel 7-inch color touch screen, temperature curve display \ EXCEL data export
Sensors PT100 A-grade platinum resistor
Protector Heater dual temp protection, refrigeration system protection, and electrical overcurrent and overload protection, etc
Dimensions (W*H*D)cm 149*219*257 179*239*257
Power Supply 380V 50HZ
Insulation material Glass fiber cotton&polyurethane
Inner box material SUS304 stainless steel
Outer box material Cold-rolled steel plate+spray coating
执行满足标准 GB/T 2423.1、GB/T 2423.2、GJB 150.3A、GJB 150.4A、GB/T 5170

APPLICATIONS

Temperature control unit of semiconductor FAB process

Semiconductor manufacturing is a process with extremely high environmental requirements, and many process steps are very sensitive to temperature.
Precise temperature control can ensure uniform thickness and accurate composition of deposited films, thereby improving chip performance and yield.

Learn more

Temperature Control Solutions for Semiconductor packaging and testing process

Semiconductor packaging and testing process is a key link in the semiconductor production process, including wafer testing, chip packaging and post-packaging testing. This process requires not only a high degree of accuracy and reliability, but also strict temperature control to ensure product quality and performance.

Learn more>

contact us

Submit your request to us and we will contact you within 24 hours

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*
Submitting….
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Submission failed! Please try again later
Email error!
Phone error!
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]]> https://www.lneya.com/product/chambers/two-door-shock.html/feed 0 Left & Right Multi-layer Test Chamber https://www.lneya.com/product/chambers/left-right-chamber.html https://www.lneya.com/product/chambers/left-right-chamber.html#respond Fri, 17 Jan 2025 05:01:03 +0000 https://www.lneya.com/industrial-chiller/left-right-multi-layer-test-chambers.html
Left & Right Multi-layer Test Chamber

Test Chambers

APPLICATIONS

Left and right multi-layer test chambers provide temperature range -80℃~+150℃ wide temperature range temperature control, no-load temperature uniformity ±1℃, temperature accuracy ±0.1℃, to meet the needs of diverse scenarios.

Get support services

Product Features

First
FirstHeating rate -40 ℃ →+125 ℃ 1 ℃/min
Cooling rate 125 ℃ → -40 ℃ 1 ℃/min
(No load) (customizable for 5-25 ℃)
Second
SecondTemperature range: -80℃~150℃
Third
ThirdTemperature accuracy ≤±0.1℃
Fourth
FourthTemperature uniformity ≤±1℃ (no load)

Product Parameters

Mode

GD-518-2-C-DC
nside
dimensions
(W*H*D)		 Left cavity cm 60*124.5*65
Right cavity cm 60*124.5*65
Temperature range  -80℃~150℃
Heating rate (No load) -40 ℃ →+125 ℃ 1 ℃/min (customizable for 5-25 ℃)
Cooling rate (No load) 125 ℃ → -40 ℃ 1 ℃/min (customizable for 5-25 ℃)
Temperature uniformity ≤±1℃(unloaded)
Temperature accuracy ≤±0.1℃
Cryogen R404A/R23
Heater Electric heating
Condenser（A） finned heat exchanger
Condenser（W） plate/sleeve/shell and tube heat exchanger
Air circulation Extended shaft motor, stainless steel centrifugal fan blades
Cooling method Cascade refrigeration
Compressor Brand variable frequency compressor
Control method Segmented Fuzzy PID Algorithm Control
Communication protocol interface TCP/RS485 (CAN customizable)
Operation panel 7-inch color touch screen, temperature curve display \ EXCEL data export
Sensors PT100 A-grade platinum resistor
Protector Heater dual temp protection, refrigeration system protection, and electrical overcurrent and overload protection, etc
Outer box size (W*H*D) cm 409*236*175
Power Supply 380V 50HZ
Insulation material Glass fiber cotton&polyurethane
Inner box material SUS304 stainless steel
Outer box material Cold-rolled steel plate+spray coating
Execution standards GB/T 2423.1;GB/T 2423.2;GB/T 2423.3;GB/T 2423.4;GB/T 5170.2;GB/T 5170.5;GB/T 11158;GB/T 10589;GB/T 10592; GB/T 10586;IEC 60068-3-5

 

APPLICATIONS

Temperature control unit of semiconductor FAB process

Semiconductor manufacturing is a process with extremely high environmental requirements, and many process steps are very sensitive to temperature.
Precise temperature control can ensure uniform thickness and accurate composition of deposited films, thereby improving chip performance and yield.

Learn more

Temperature Control Solutions for Semiconductor packaging and testing process

Semiconductor packaging and testing process is a key link in the semiconductor production process, including wafer testing, chip packaging and post-packaging testing. This process requires not only a high degree of accuracy and reliability, but also strict temperature control to ensure product quality and performance.

Learn more>

Recommend Products

Unfortunately, the information you searched was not found

]]> https://www.lneya.com/product/chambers/left-right-chamber.html/feed 0 GD Series Rapid Temperature Change Test Chamber https://www.lneya.com/product/chambers/rapid-temp-change-test-chamber.html https://www.lneya.com/product/chambers/rapid-temp-change-test-chamber.html#respond Fri, 17 Jan 2025 03:58:36 +0000 https://www.lneya.com/industrial-chiller/gd-series-rapid-temperature-change-test-chamber.html
GD Series Rapid Temperature Change Test Chamber

Test Chambers

APPLICATIONS

It is suitable for environmental stress screening tests. By performing environmental stress screening on products, it accelerates the discovery of product design defects and improves product reliability. Many industrial fields have realized that high-speed temperature change cycle tests can find unreliable systems that have entered the production test stage. It has been used as a standard method to improve quality and effectively extend the normal working life of products.

Get support services

Product Features

First
FirstHeating rate: (+20~+150℃) A: 5℃/min (15~25℃ customizable) 5℃/min adjustable nonlinear
Second
SecondTemperature accuracy: ≤±0.1℃
Third
ThirdCooling rate: (+20~-40℃) 5℃/min (no load)
Fourth
FourthTemperature uniformity: ≤±1℃ (no load)

Product Parameters

Model GD-500-B-KS GD-1000-B-KS GD-500-C-KS GD-500-C-KS
Temperature range -40℃~+150℃  -80℃~+150℃
Inner box size (W*H*D) cm 90*65*90 100*100*100 90*65*90 100*100*100
Heating rate (+20~+150℃)A：5℃/min（Customizable at 15~25℃）,5℃/min Adjustable nonlinearity
Cooling rate （Carrying idler）(+20~-40℃)5℃/min （Carrying idler）10℃/min（Customizable at 15~25℃）
Temperature uniformity ≤±1℃(unloaded)
Temperature fluctuation ≤±0.5℃
Temperature accuracy ≤±0.1℃
Window size cm 30*45 45*49 30*45 45*49
Cryoge R404A/R23
Test hole φ100mm×1
Heater Electric heating
Condenser（A) Air cooling: finned heat exchanger
Condenser（W)  Water cooling: plate/sleeve/shell and tube heat exchanger
Air circulation Extended shaft motor, stainless steel centrifugal fan blades
Cooling method Cascade refrigeration
Compressor Brand variable frequency compressor
Control method Segmented Fuzzy PID Algorithm Control
Communication protocol interface TCP/RS485 (CAN customizable)
Operation pane 7-inch color touch screen, temperature curve display \ EXCEL data export
Sensors PT100 A-grade platinum resistor
Protector Heater dual temp protection, refrigeration system protection, and electrical over current and over load protection, etc
Outer box size (W*H*D) cm 110*212*175 120*232*225 110*212*175 120*232*225
Power Supply 380V 50HZ
Texture of materia Insulation material: glass fiber cotton&polyurethane
Inner box material: SUS304 stainless steel;
Outer box material: cold-rolled steel plate+spray coating
Execution standards GB/T 2423.1;GB/T 2423.2;GB/T 2423.3;GB/T 2423.4;GB/T 5170.2;GB/T 5170.5;GB/T 11158;GB/T 10589;GB/T 10592; GB/T 10586;IEC 60068

 

APPLICATIONS

Temperature control unit of semiconductor FAB process

Semiconductor manufacturing is a process with extremely high environmental requirements, and many process steps are very sensitive to temperature.
Precise temperature control can ensure uniform thickness and accurate composition of deposited films, thereby improving chip performance and yield.

Learn more

Temperature Control Solutions for Semiconductor packaging and testing process

Semiconductor packaging and testing process is a key link in the semiconductor production process, including wafer testing, chip packaging and post-packaging testing. This process requires not only a high degree of accuracy and reliability, but also strict temperature control to ensure product quality and performance.

Learn more>

Recommend Products

Unfortunately, the information you searched was not found

]]> https://www.lneya.com/product/chambers/rapid-temp-change-test-chamber.html/feed 0 KRYCH Series Battery Pack Test Chamber https://www.lneya.com/product/chambers/krych.html https://www.lneya.com/product/chambers/krych.html#respond Fri, 17 Jan 2025 03:18:51 +0000 https://www.lneya.com/industrial-chiller/krych-series-battery-pack-test-chamber.html
KRYCH Series Battery Pack Test Chamber

Test Chambers

APPLICATIONS

The power battery temperature cycle chamber is a high and low temperature test device for power battery samples. It is currently mainly used in the new energy battery industry. It can directly complete high and low temperature charging and discharging, or high and low temperature storage, for battery cells, modules, and PACKs in the test box. In the event of battery failure, explosion-proof pressure relief and fire protection devices are added.

Get support services

Product Features

First
FirstTemperature | flow | pressure control accuracy, ±0.1℃, ±0.2L/min
Second
SecondRefrigeration system adopts frequency conversion control, efficient operation, energy saving of more than 200%;
Third
ThirdUpper and lower double-layer box design, the box contains antifreeze battery cooling system, the control and test systems of the two-layer box are completely independent;
Fourth
FourthInsulation layer is made of insulation materials with low thermal conductivity and high temperature resistant materials, with a thickness of 100mm, which can meet the long-term high and low temperature impact requirements of -40℃ to 100℃

Product Parameters

GD series & KRYCH series  -40℃～100℃

 

Model GD-9000-2-B1-KRYCH-4A15W GD-9000-2-B1-KRYCH-475W GD-9000-2-B1-KRYCH-4A10W GD-1000-B1-KRYCH-475
Temperature range -40℃～100℃
Antifreeze		 -40℃～100℃
Test Chamber		 -40℃～100℃
Antifreeze		 -40℃～100℃
Test Chamber		 -40℃～100℃
Antifreeze		 -40℃～100℃
Test Chamber		 -40℃～100℃
Antifreeze		 -40℃～100℃
Test Chamber
Antifreeze flow control 1L/min~40L/min 1L/min~25L/min 1L/min~25L/min 1L/min~10L/min
±0.2L/min ±0.2L/min ±0.2L/min ±0.2L/min
Antifreeze pressure Measure and display the inlet and outlet pressure, as well as the pressure displayed on the touch screen
Chamber(W*H*D) Upper cavity cm 220*322*120 220*322*120 220*322*120 Single cavity:100*100*100
Lower cavitycm 220*322*110 220*322*110 220*322*110
Heating power 15kW 14kW 7.5kW 14kW 10kW 14kW 7.5kW 6kW
Cooling
capacity
Antifreeze		 135℃ 15kW 7.5kW 10KW 7.5kW
20°℃ 15kW 7.5kW 10KW 7.5kW
0℃ 15kW 7.5kW 10KW 7.5kW
-20℃ 10kW 4.5kW 6KW 4.5kW
-35℃ 4kW 1.8kW 2.5KW 1.8kW
Chamber Heating rate 25～+100℃≥±2℃/Min   （No load, average throughout the entire process） （Customizable at 5~25℃）
Cooling rate 25～-40℃≥1℃/Min（No load, average throughout the entire process） （Customizable at 5~25℃）
Antifreeze temp control accuracy ±0.1℃
Temperature uniformity ≤±1℃(unloaded)
Circulating air volume 5000m³/h 2500m³/h
Control mode Segmented Fuzzy PID Algorithm Control
Communication protocol CAN/TCP/RS485
Temperature feedback Internal temperature of equipment enclosure, condensation temperature of refrigeration system,
suction temperature of compressor, cooling water temperature (for water-cooled equipment)
High temp cooling module Can cool down from a high temperature of 100 ℃
Circulating pump Magnetic drive pump
Compressor Brand variable frequency compressor
Evaporator Plate/fin heat exchanger
Refrigeration accessories Emerson/Danfoss brand dry filters, oil separators, etc
Throttle method Electronic expansion valve
Refrigerant R125/R404A
Safety protection Phase sequence failure protector, freezer overload protection; High pressure switch, overload relay, thermal
protection device and other safety protection functions.
water-cooled condenser Shell and tube heat exchanger
Operation panel 10 inch color touch screen 7 inch color touch screen
Antifreeze interface ZG3/4 ZG3/8
Cooling water 20 ℃ 25m³/H 20m³/H 20m³/H 7m³/H
Dimension cm 240*560*285 240*560*285 240*560*285 120*205*205
Bearing 1500kg 1500kg 1500kg 120kg
Weight 4600kg 4200kg 4200kg 600kg
Power supply 380V 50HZ
Insulation material Glass fiber cotton&polyurethane
Inner box material SUS304 stainless steel brushed plate
External materia Cold rolled steel plate+spray coating
Execution standards GB/T 2423.1;GB/T 2423.2;GB/T 2423.3;GB/T 2423.4;GB/T 5170.2;GB/T 5170.5;GB/T 11158;GB/T 10589;GB/T 10592; GB/T 10586;IEC 60068

 

APPLICATIONS

Temperature control unit of semiconductor FAB process

Semiconductor manufacturing is a process with extremely high environmental requirements, and many process steps are very sensitive to temperature.
Precise temperature control can ensure uniform thickness and accurate composition of deposited films, thereby improving chip performance and yield.

Learn more

Temperature Control Solutions for Semiconductor packaging and testing process

Semiconductor packaging and testing process is a key link in the semiconductor production process, including wafer testing, chip packaging and post-packaging testing. This process requires not only a high degree of accuracy and reliability, but also strict temperature control to ensure product quality and performance.

Learn more>

Recommend Products

Unfortunately, the information you searched was not found

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