The following points should be paid attention to when operating the semiconductor wafer cutting and cooling device:
1. The voltage range of general compressors and other components is not allowed to exceed the rated voltage range. If the unit has unstable voltage or lack of equal failure during operation, it will seriously cause the compressor, water pump and other motor components to burn. Therefore, it is very important to check whether the power supply voltage value of the semiconductor wafer rapid cooling device is consistent with the voltage and frequency marked on the equipment. In addition, it is also necessary to check whether the wiring of the electronic control part of the semiconductor wafer cutting cooling device such as contactors, sensors, etc. is firm. .
2. After checking the electronic control system and the water circulation system, it is also necessary to check the refrigeration system. This is generally to check the high pressure pressure gauge and low pressure pressure gauge. Based on the pressure value displayed above, we can determine whether the refrigerant and system of the semiconductor wafer cutting cooling device are Normal, if the pressure value is zero or the high and low pressure exceeds the normal range, you need to troubleshoot the fault before starting.
3. After we have checked the circuit of the semiconductor wafer cutting and cooling device, we must also check whether the water system (may include cooling water system, chilled water system, and water supply source, etc.) is operating normally, such as whether the valve on the water circulation pipeline has been opened, etc. .
4. To ensure the long-term stable operation of the semiconductor wafer cutting and cooling device requires operators to understand more relevant knowledge, such as component composition and operating principles, standardized operating procedures and maintenance knowledge, etc. Of course, if there is a dedicated person to be responsible for operation and maintenance It's even better.
Equipment operators should carefully read the instructions for use of the semiconductor wafer cutting and cooling device and the technical training content provided by the manufacturer, and follow the steps to operate and maintain, so as to ensure the stable operation of the semiconductor wafer cutting and cooling device.