Why do you want to test the chip high and low temperature aging?
The testing of the chip industry is related to the quality of each chip version. Therefore, the chip high and low temperature aging test box is very necessary in the development of the chip industry. Then, why should the chip high and low temperature aging test run?
The complexity of the chip is getting higher and higher. In order to ensure that there is no problem with the factory chip, it needs to be tested before leaving the factory to ensure functional integrity. As a large-scale production of chips, large-scale automated testing is the only solution. It is impossible to accomplish such tasks by manual or bench test. The high and low temperature aging test box of the chip is actually a relatively large category. Generally, it is divided into a wafer test and a final test from the object of the test, and the object is a chip that has not been packaged, and a chip that has been packaged. Why do you want to divide it into two paragraphs? To put it simply, because the package is also cost-effective, in order to save the cost as much as possible, some tests may be performed before the chip package to eliminate some broken chips. In order to ensure that the chip is no problem, the final test, that is, the FT test is an interception, but also a necessary link.
In general, the chip high and low temperature aging test box includes pin connectivity test, leakage current test, some DC (direct current) test, functional test (functional test), Trim test, and some other tests depending on the chip type. For example, AD/DA will have some special test types. The purpose of the chip test is to find the chip that is not problematic while saving the cost as much as possible. Therefore, the type of defect that is easy to detect or relatively common will be detected first. In general, the first thing you will do is the connectivity test, which we call the continuity test. This is to check if the connectivity of each pin is normal.
The chip high and low temperature aging test box is mainly for the chip industry to save costs, and can give priority to the quality of the chip, so LNEYA chip high and low temperature aging test box is very necessary.
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